From the design idea to the finished product, the whole process is strictly controlled and monitored, ensuringexcellent quality control.
It has significant technical advantages. Based on a unified framework and positioning pin design, it can widelybe compatible with the vast majority of chips of different sizes and packaging types on the market. At thesame time, according to diverse testing requirements and chip characteristics, it can be adapted to probes ofdifferent specifications. in numerous application scenarios, this product demonstrates stable and reliable testingperformance.
Socket outlines:28x33mm
Insulation Resistance:>1000mQ at 100V DC
Fix PCB: Bolt Mounting
Contact Force:12gf& 25 gf/Option
Temperature Rating: -40°C~+155°C
For Small latch solution
PinOperation Force: AVR 1.0~8.0kg
Current Rating:3.5 amps
Bandwidth:6~14GHz@-1dB
Capacitance:0.87 pF
Resistance:<100 mΩ
Self Inductance: 1.22 nH
| Socket Series | Contact Type | Size(mm) | IC size (Min) | IC size (Max) | pitch (mm) | IC PKG | OperatingTemp | Pin Count |
|---|---|---|---|---|---|---|---|---|
| MP | Pogo-pin | 28*32mm | 0.7x1.0mm Min | 15x15mm Max | 0.3\0.35\0.4\0.5\ 0.8...不限 | QFN\WLCSP\ BGA\QFP | -55°~+150° | ≤150pins |
| MW | Pogo-pin or BOW Contact | 26*26mm | 2x2mm Min | 14x18mm Max | 0.3\0.35\0.4\0.5\ 0.9...不限 | BGA\QFN\ SOP\LGA | -55°~+150° | ≤110pins |
| MRF | PCR Pogo-pin | 26*28mm | 3x3mm Min | 14x18mm Max | 0.3\0.35\0.4\0.5\ 0.10...不限 | BGA\WLCSP\ QFN | OperatingTemp | ≤200pins |
| MA | Pogo-pin or Other | 非标定制化 | 0.75x0.74mm Min | 55x55mm Max | 0.3\0.35\0.4\0.5\ 0.11...不限 | WLCSP\QFP\ Modular | OperatingTemp | 不限 |
