一站式解决半导体芯片测试座方案

OKsolution is a Chinese high-tech enterprise that focuses on the develop and manufacturing of Open-Top types、Clamshell types and Reliability testing sockets. 

Dedicated to providing excellent products and services to high-quality customers, chip design companies, packaging and testing factories (OSAT), programming, reliability testing, and research institutes (LAB). 

With more than 15+ years of professional research and industry accumulation, the OKS team has served and solved over 2000+ types of chip packaging types, including open top aging and probe type functional testing sockets.

The service IC chip covers multiple types of packaged chips, including WLCSP, QFN, BGA, SOP, QFP, LGA, DIP, Modular etc.  a typical case is that successfully solved the smallest wafer level chip WLCSP 0.7x0.7x0.25mm automatic testing on an open top socket, while also solving a series of industry problems such as "flying", "sticking", "material damage", and "low yield" of wafer level chip WLCSP. 

Obtained multiple independent intellectual property utility models and invention patents, such as being applied in lead type chip testing to solve the problem of “QFP” and other lead bending", "warping", "deformation" and high conductivity efficiency solutions; 

Able to help customers solve:

[Quick-迅速] Provide solutions within 24 hours, with an average delivery time of within 10 days.

[Reliable-靠谱 ] We have served and solved test socket solutions over 2000+ types of packaged chips.

[Professional-专业 ] With over 10 years of industry accumulation and specialized research in testing positions.